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1. general description the hef4049b provides six inverting buffers with high current output capability suitable for driving ttl or high capaci tive loads. since input voltages in excess of the buffers? supply voltage are permitted, the buffers may also be used to convert logic levels of up to 15 v to standard ttl levels. their guaranteed fan-out into common bipolar logic elements is shown in table 3 . it operates over a recommended v dd power supply range of 3 v to 15 v referenced to v ss (usually ground). unused inputs must be connected to v dd , v ss , or another input. 2. features and benefits ? accepts input voltages in excess of the supply voltage ? fully static operation ? 5 v, 10 v, and 15 v parametric ratings ? standardized symmetrical output characteristics ? specified from ? 40 ? c to +85 ? c ? complies with jedec standard jesd 13-b 3. applications ? locmos (local oxidation cmos) to dtl/ttl converter ? high sink current for driving two ttl loads ? high-to-low level logic conversion 4. ordering information hef4049b hex inverting buffers rev. 9 ? 18 november 2011 product data sheet table 1. ordering information all types operate from ? 40 ? c to +85 ? c. type number package name description version hef4049bp dip16 plastic dual in-line package; 16 leads (300 mil) sot38-4 hef4049bt so16 plastic small outline packa ge; 16 leads; body width 3.9 mm sot109-1
hef4049b all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 9 ? 18 november 2011 2 of 12 nxp semiconductors hef4049b hex inverting buffers 5. functional diagram 6. pinning information 6.1 pinning 6.2 pin description fig 1. logic symbol fig 2. logic diagram for one gate fig 3. input protection circuit 001aai331 3 1a 1y 2 5 2a 2y 4 7 3a 3y 6 9 4a 4y 10 11 5a 5y 12 14 6a 6y 15 mna341 a y 001aae604 input v ss fig 4. pin configuration hef4049b v dd n.c. 1y 6y 1a 6a 2y n.c. 2a 5y 3y 5a 3a 4y v ss 4a 001aae602 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 table 2. pin description symbol pin description v dd 1 supply voltage 1y to 6y 2, 4, 6, 10, 12, 15 output
hef4049b all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 9 ? 18 november 2011 3 of 12 nxp semiconductors hef4049b hex inverting buffers 7. functional description 8. limiting values [1] for dip16 package: p tot derates linearly with 12 mw/k above 70 ? c. [2] for so16 package: p tot derates linearly wi th 8 mw/k above 70 ? c. 9. recommended operating conditions 1a to 6a 3, 5, 7, 9, 11, 14 input v ss 8 ground supply voltage n.c. 13, 16 not connected table 2. pin description ?continued symbol pin description table 3. guaranteed fan-out driven element guaranteed fan-out standard ttl 2 74 ls 9 74 l 16 table 4. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v dd supply voltage ? 0.5 +18 v i ik input clamping current v i < ? 0.5 v or v i >v dd + 0.5 v - ? 10 ma v i input voltage ? 0.5 v dd + 0.5 v i ok output clamping current v o < ? 0.5 v or v o >v dd + 0.5 v - ? 10 ma i i/o input/output current - ? 10 ma i dd supply current - 50 ma t stg storage temperature ? 65 +150 ?c t amb ambient temperature ? 40 +85 ?c p tot total power dissipation t amb ? 40 ? c to +85 ?c dip16 package [1] - 750 mw so16 package [2] - 500 mw p power dissipation per output - 100 mw table 5. recommended operating conditions symbol parameter conditions min typ max unit v dd supply voltage 3 - 15 v v i input voltage 0 - v dd v t amb ambient temperature in free air ? 40 - +85 ?c
hef4049b all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 9 ? 18 november 2011 4 of 12 nxp semiconductors hef4049b hex inverting buffers 10. static characteristics ? t/? v input transition rise and fall rate v dd = 5 v - - 3.75 ? s/v v dd = 10 v - - 0.5 ? s/v v dd = 15 v - - 0.08 ? s/v table 5. recommended operating conditions ?continued symbol parameter conditions min typ max unit table 6. static characteristics v ss = 0 v; v i = v ss or v dd unless otherwise specified. symbol parameter conditions v dd t amb = ? 40 ?c t amb = 25 ?c t amb = 85 ?c unit min max min max min max v ih high-level input voltage ?i o ? < 1 ? a 5 v 3.5 - 3.5 - 3.5 - v 10 v 7.0 - 7.0 - 7.0 - v 15 v 11.0 - 11.0 - 11.0 - v v il low-level input voltage ?i o ? < 1 ? a 5 v - 1.5 - 1.5 - 1.5 v 10 v - 3.0 - 3.0 - 3.0 v 15 v - 4.0 - 4.0 - 4.0 v v oh high-level output voltage ?i o ? < 1 ? a 5 v 4.95 - 4.95 - 4.95 - v 10 v 9.95 - 9.95 - 9.95 - v 15 v 14.95 - 14.95 - 14.95 - v v ol low-level output voltage ?i o ? < 1 ? a 5 v - 0.05 - 0.05 - 0.05 v 10 v - 0.05 - 0.05 - 0.05 v 15 v - 0.05 - 0.05 - 0.05 v i oh high-level output current v o = 2.5 v 5 v - ? 1.7 - ? 1.4 - ? 1.1 ma v o = 4.6 v 5 v - ? 0.52 - ? 0.44 - ? 0.36 ma v o = 9.5 v 10 v - ? 1.3 - ? 1.1 - ? 0.9 ma v o = 13.5 v 15 v - ? 3.6 - ? 3.0 - ? 2.4 ma i ol low-level output current v o = 0.4 v 4.75 v 3.5 - 2.9 - 2.3 - ma v o = 0.5 v 10 v 12.0 - 10.0 - 8.0 - ma v o = 1.5 v 15 v 24.0 - 20.0 - 16.0 - ma i i input leakage current v dd = 15 v 15 v - ? 0.3 - ? 0.3 - ? 1.0 ? a i dd supply current i o = 0 a 5 v - 4.0 - 4.0 - 30 ? a 10 v - 8.0 - 8.0 - 60 ? a 15 v - 16.0 - 16.0 - 120 ? a c i input capacitance - - - 7.5 - - pf
hef4049b all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 9 ? 18 november 2011 5 of 12 nxp semiconductors hef4049b hex inverting buffers 11. dynamic characteristics [1] the typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (c l in pf). table 7. dynamic characteristics v ss = 0 v; c l = 50 pf; t r = t f ? 20 ns; t amb = 25 ? c; unless otherwise specified. symbol parameter conditions v dd extrapolation formula min typ max unit t phl high to low propagation delay na to ny; see figure 5 5 v [1] 26 ns + (0.18 ns/pf)c l -3570ns 10 v 11 ns + (0.08 ns/pf)c l -1530ns 15 v 9 ns + (0.05 ns/pf)c l -1225ns t plh low to high propagation delay na to ny; see figure 5 5 v [1] 23 ns + (0.55 ns/pf)c l - 50 100 ns 10 v 14 ns + (0.23 ns/pf)c l -2550ns 15 v 12 ns + (0.16 ns/pf)c l -2040ns t thl high to low output transition time see figure 5 5 v [1] 3 ns + (0.35 ns/pf)c l -2040ns 10 v 3 ns + (0.14 ns/pf)c l -1020ns 15 v 2 ns + (0.09 ns/pf)c l -714ns t tlh low to high output transition time see figure 5 5 v [1] 10 ns + (1.00 ns/pf)c l - 60 120 ns 10 v 9 ns + (0.42 ns/pf)c l -3060ns 15 v 6 ns + (0.28 ns/pf)c l -2040ns table 8. dynamic power dissipation p d p d can be calculated from the formulas shown. v ss = 0 v; t r = t f ? 20 ns; t amb = 25 ? c. symbol parameter v dd typical formula for p d ( ? w) where: p d dynamic power dissipation 5 v p d = 2500 ? f i + ? (f o ? c l ) ? v dd 2 f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v dd = supply voltage in v; ? (f o ? c l ) = sum of the outputs. 10 v p d = 11000 ? f i + ? (f o ? c l ) ? v dd 2 15 v p d = 35000 ? f i + ? (f o ? c l ) ? v dd 2
hef4049b all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 9 ? 18 november 2011 6 of 12 nxp semiconductors hef4049b hex inverting buffers 12. waveforms measurement points are given in table 9 . v ol and v oh are typical output voltage levels that occur with the output load. fig 5. input (na) to output (ny) propagation delays and transition times 001aai336 input output t plh t phl 0 v v i v m v m v oh v ol t tlh t thl 90 % 10 % 10 % 90 % t r t f table 9. measurement points input output v m v i v m v x v y 0.5v dd 0 v to v dd 0.5v dd 0.1v dd 0.9v dd test data is given in table 10 . definitions for test circuit: c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to output impedance z o of the pulse generator. fig 6. load circuitry for switching times v dd v i v o 001aag182 dut c l r t g table 10. test data supply voltage input load v i v m t r , t f c l 5vto15v v dd 0.5v i ? 20 ns 50 pf
hef4049b all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 9 ? 18 november 2011 7 of 12 nxp semiconductors hef4049b hex inverting buffers 13. package outline fig 7. package outline sot38-4 (dip16) references outline version european projection issue date iec jedec jeita sot38-4 95-01-14 03-02-13 m h c (e ) 1 m e a l seating plane a 1 w m b 1 b 2 e d a 2 z 16 1 9 8 e pin 1 index b 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. unit a max. 12 b 1 (1) (1) (1) b 2 cd e e m z h l mm dimensions (inch dimensions are derived from the original mm dimensions) a min. a max. b max. w m e e 1 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 0.76 4.2 0.51 3.2 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.03 0.17 0.02 0.13 dip16: plastic dual in-line package; 16 leads (300 mil) sot38-4
hef4049b all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 9 ? 18 november 2011 8 of 12 nxp semiconductors hef4049b hex inverting buffers fig 8. package outline sot109-1 (so16) x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 8 9 1 16 y pin 1 index unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz ywv references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot109-1 99-12-27 03-02-19 076e07 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale so16: plastic small outline package; 16 leads; body width 3.9 mm sot109-1
hef4049b all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 9 ? 18 november 2011 9 of 12 nxp semiconductors hef4049b hex inverting buffers 14. abbreviations 15. revision history table 11. abbreviations acronym description dtl diode transistor logic dut device under test locmos local oxidation cmos ttl transistor transistor logic table 12. revision history document id release date data sheet status change notice supersedes hef4049b v.9 20111118 product data sheet - hef4049b v.8 modifications: ? table 6 : i oh minimum values changed to maximum ? table 11 : added dut hef4049b v.8 20091202 product data sheet - hef4049b v.7 hef4049b v.7 20090721 product data sheet - hef4049b v.6 hef4049b v.6 20090325 product data sheet - hef4049b v.5 hef4049b v.5 20081111 product data sheet - hef4049b v.4 hef4049b v.4 20080704 product data sheet - hef4049b_cnv v.3 hef4049b_cnv v.3 19950101 product specification - hef4049b_cnv v.2 hef4049b_cnv v.2 19950101 product specification - -
hef4049b all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 9 ? 18 november 2011 10 of 12 nxp semiconductors hef4049b hex inverting buffers 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from competent authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
hef4049b all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 9 ? 18 november 2011 11 of 12 nxp semiconductors hef4049b hex inverting buffers non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors hef4049b hex inverting buffers ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 18 november 2011 document identifier: hef4049b please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 functional description . . . . . . . . . . . . . . . . . . . 3 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 9 recommended operating conditions. . . . . . . . 3 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 4 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 10 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 17 contact information. . . . . . . . . . . . . . . . . . . . . 11 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

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